“这些MCU采用高性能硅栅CMOS工艺制造，嵌入了R8C/Tiny系列CPU核，为52针，模压塑料，LQFP，或64针模压塑料FLGA封装。它可以执行高效率的复杂指令。
”These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/25 Group has on-chip data flash (1 KB x 2 blocks). The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their peripheral functions are the same.
Applications
Electronic household appliances
Office equipment
Audio equipment
Consumer products
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